Graduate Program in Mechanical Engineering
Prof. Mike Lambert

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My research interests include electronic packaging and energy systems.

With regard to electronic packaging, my primary focus is on advanced cooling techniques and materials development and experimental characterization.  To that end I am currently equipping an Electronics Packaging Laboratory, which is soon to come on-line with a wind tunnel for convective cooling tests, and a shaker table for simulating shock and vibration.  This laboratory will later include equipment for testing solder joints, a solder reflow furnace, and photolithography equipment for demonstrating silicon chip production.

As for energy systems, I am currently developing a proposal for funding research into a heat-powered heat pump (air conditioner) that employs the solid-vapor adsorption cycle instead of the ubiquitous vapor compression cycle currently predominate.  Solid-vapor adsorption cycles can be powered by clean-burning natural gas, thereby reducing already strained demand on the electricity supply grid.